Report

worldwide electronic smart packaging market drivers opportunities trends and forecasts 2016 2022

Worldwide Electronic Smart Packaging Market – Technologies (RFID, NFC, BLE and EAS), Applications (Printed Sensor, Printed Touch, Printed Light, Printed RFID and Printed Antennas), End-Users (Food, Beverage, Healthcare, Personal Care, Logistics and Machineries), By Regions – Drivers, Opportunities, Trends, and Forecasts, 2016-2022

pages Pages: 127
tables Tables: 74
charts Charts: 43
country Regions/Countries: 4/7
compaines Companies: 13
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Overview

Smart Packaging technology are gradually replacing traditional packaging for the improved quality and shelf life that they offer. Smart packaging offers myriad functionalities in addition to the basic function of protection, communication and containment. The smart packaging interacts internally and externally with the environment and performs a plethora of functions such as monitoring of freshness, safety, information, quality and others. There are different types of packaging such as electronic, electrical, mechanical/chemical. It is expected that the electronic smart packaging will grow faster in the coming years.

Market Analysis

According to Infoholic Research, it is estimated that the Worldwide Electronic Smart Packaging Market will witness a CAGR of 45.5% during the forecast period 2016–2022. The hyper growth in future will be triggered due to the use of printed electronics in packaging. Printed electronics is a key enabling factor for smart packaging innovations. There exists an enhanced demand for intelligent food packaging solutions.

The electronic smart packaging can be used to send sound, light, display or electronic signals. This makes the packaging highly attractive, secure and interactive. The new printed electronic technology in packaging will support various packaging substrates to bring down the cost of packaging as well. It is expected that electronic smart packaging will drive the market in the coming years for its lower price, flexibility and additional functionality of the packaging. The electronic smart packaging market is segmented by technologies, applications, end-users and geographic regions. The electronic smart packaging market is expected to grow due to the increasing demand for consumer goods, increase in the population, lack of organic products, and reduction of life span of food products and low-cost electronics.

Geographic segmentation

North America, Europe, Asia-Pacific and MEA are the key regions covered in the report.

Segmentation by End-Users

The Worldwide Electronic Smart Packaging Market is segmented by the following end-user types – Food, Beverage, Healthcare, Personal Care, Logistics/Transportation, Industry Machineries and Others.

Segmentation by Applications

The Worldwide Electronic Smart Packaging Market is segmented by the following application types – Printed Light, Printed Touch, Printed Antennas, Printed RFID, Printed Sensors and Others.

Competitive Analysis

The study gives an opportunity to the industry players to improve their current business approach by providing them strategic intelligence about the competition in the market. Current and predicted business strategies for the leading companies of the market

The Worldwide Electronic Smart Packaging Market report includes a detailed competitive benchmarking of the leading vendors based on some key metrics such as business units, geographic revenue, recent developments, business focus, business strategy and SWOT analysis.

Key Vendors

Some of the players included in the report are Thin Film Electronics, Smartrac NV, Bemis Company, Sealed Air and PakSense.

Benefits

The report will be useful to the key stakeholders of the electronic smart packaging market such as packaging industries, technology providers, end-users and electronic providers in the following ways:

 


  • Competitive analysis (i.e. current and future key business strategies of the competitors and their regional growth)

  • Drivers and growth opportunities in different regions



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The report includes Information related to latest industry and market trends, key stakeholders, industry pest analysis and competitive landscape and details of ongoing and upcoming electronic smart packaging projects. The report provides a comprehensive analysis of the electronic smart packaging market aiming to bring improved supply chain process, better brand image, customer loyalty and improved quality of food. The report provides a detailed analysis of the electronic smart packaging in terms of technologies, applications, end-users and regions. It also provides a detailed analysis of the printed electronics in the smart packaging. In addition, the report also gives details about the printed electronics investments in smart packaging and ongoing and upcoming electronic smart packaging projects.

 

1 Industry Outlook
1.1 Industry Overview
1.2 Pest Analysis

2 Electronic Smart Packaging Market Report Outline
2.1 Report Scope
2.2 Report Summary
2.3 Research Methodology
2.4 Report Assumptions

3 Electronic Smart Packaging Market Snapshot
3.1 Total Addressable Market (TAM)
3.2 Segmented Addressable Market (SAM)
3.3 Related Markets

4 Electronic Smart Packaging
4.1 Overview
4.2 Market Trends and Impact
4.3 Types of Packaging
4.3.1 Passive Packaging
4.3.2 Active Packaging
4.3.3 Smart Packaging
4.4 Market Segmentation
4.5 Porter’s 5 (Five) Forces

5 Market Characteristics
5.1 Evolution
5.2 Architecture
5.3 Market Dynamics
5.3.1 Drivers
5.3.1.1 Technology adoption
5.3.1.2 Consumer demand
5.3.1.3 Ageing population
5.3.1.4 Low cost and less weight
5.3.2 Restraints
5.3.2.1 Lack of awareness about electronics in smart packaging
5.3.2.2 Increasing competition leading to price war
5.3.3 Opportunities
5.3.3.1 Use of NFC technology
5.3.3.2 Improving market conditions and falling costs
5.3.4 DRO – Impact Analysis

6 Printed Electronics in Smart Packaging
6.1 Overview
6.1.1 Printed electronic in smart packaging and their challenges
6.1.2 Electronics v/s Printed Electronics
6.1.3 Scope of printed electronics in smart packaging
6.1.4 Future impact of electronics in smart packaging
6.1.5 Future Investment and projects

7 Technology: Market Size and Analysis
7.1 Overview
7.2 Radio Frequency Identification (RFID)
7.2.1 Market Size and Analysis
7.3 NFC
7.3.1 Market Size and Analysis
7.4 Bluetooth Low Energy (BLE)
7.4.1 Market Size and Analysis
7.5 Electronic Article Surveillance (EAS)
7.5.1 Market Size and Analysis

8 Applications: Market Size and Analysis
8.1 Overview
8.2 Printed Light
8.2.1 Market Size and Analysis
8.3 Printed Touch
8.3.1 Market Size and Analysis
8.4 Printed Antennas
8.4.1 Overview
8.4.2 Market Size and Analysis
8.4.3 Printed NFC Antenna
8.4.4 Printed RFID Antenna
8.5 Printed RFID
8.5.1 Market Size and Analysis
8.6 Printed Sensors
8.6.1 Market Size and Analysis
8.7 Others
8.7.1 Market Size and Analysis

9 End-Users: Market Size and Analysis
9.1 Overview
9.2 Food
9.2.1 Market Size and Analysis
9.3 Beverage
9.3.1 Market Size and Analysis
9.4 Healthcare
9.4.1 Market Size and Analysis
9.5 Personal Care
9.5.1 Market Size and Analysis
9.6 Logistics/Transporting
9.6.1 Market Size and Analysis
9.7 Industry Machineries
9.7.1 Market Size and Analysis
9.8 Others
9.8.1 Market Size and Analysis

10 Regions: Market Size and Analysis
10.1 Overview
10.2 North America
10.2.1 Overview
10.2.2 Market Size and Analysis
10.2.2.1 US
10.2.2.2 Canada
10.3 Europe
10.3.1 Market Size and analysis
10.3.1.1 UK
10.4 Asia Pacific
10.4.1 Market Size and Analysis
10.4.1.1 Australia and New Zealand (ANZ)
10.4.1.2 China
10.4.1.3 India
10.5 MEA
10.6 Latin America

11 Vendor Profiles
11.1 Thin Film Electronics ASA
11.1.1 Overview
11.1.2 Business Unit
11.1.3 Geographic Revenue
11.1.4 Business Focus
11.1.5 SWOT Analysis
11.1.6 Business Strategy
11.2 Smartrac N.V.
11.2.1 Overview
11.2.2 Business Unit
11.2.3 Geographic Presence
11.2.4 Business Focus
11.2.5 SWOT Analysis
11.2.6 Business Strategy
11.3 Sealed Air
11.3.1 Overview
11.3.2 Business Unit
11.3.3 Geographic Revenue
11.3.4 Business Focus
11.3.5 SWOT Analysis
11.3.6 Business Strategy
11.4 Bemis Company Inc.
11.4.1 Overview
11.4.2 Business Unit
11.4.3 Geographic Presence
11.4.4 Business Focus
11.4.5 SWOT Analysis
11.4.6 Business Strategy
11.5 PakSense
11.5.1 Overview
11.5.2 Business Unit
11.5.3 Geographic Presence
11.5.4 Business Focus
11.5.5 SWOT Analysis
11.5.6 Business Strategy

12 Global Generalist
12.1 3M Co.
12.1.1 Overview
12.1.2 Cisco in Electronic Smart Packaging
12.2 Ametek Inc.
12.2.1 Overview
12.2.2 Ametek in Electronic Smart Packaging
12.3 RR Donnelley & Sons Co.
12.3.1 Overview
12.3.2 RR Donnelley in Electronic Smart Packaging
12.4 NEXX Systems Inc.
12.4.1 Overview
12.4.2 NEXX Systems Inc. in Electronic Smart Packaging

13 Companies to Watch for
13.1 PST Sensors
13.1.1 Overview
13.1.2 Market Overview
13.1.3 PST Sensors in Electronic Smart Packaging Market
13.2 Blue Spark Technologies Inc.
13.2.1 Overview
13.2.2 Market Overview
13.2.3 Blue Spark Technologies in Electronic Smart Packaging Market
13.3 Printechnologics
13.3.1 Overview
13.3.2 Market Overview
13.3.3 Printechnologics in Electronic Smart Packaging Market
13.4 Saralon GmbH
13.4.1 Overview
13.4.2 Market Overview
13.4.3 Saralon GmbH in Electronic Smart Packaging Market

14 Electronic Smart Packaging Market Competitive Landscape
14.1 Competitor Comparison Analysis
14.2 Market Landscape
14.2.1 Mergers & Acquisitions (M&A)
14.2.2 Joint Venture
14.2.3 Capital Funding

Annexure
Abbreviations

Research Framework

Infoholic Research works on a holistic 360° approach in order to deliver high quality, validated and reliable information in our market reports. The Market estimation and forecasting involves following steps:

  • Data Collation (Primary & Secondary)
  • In-house Estimation (Based on proprietary data bases and Models)
  • Market Triangulation
  • Forecasting
Methodology

Market related information is congregated from both primary and secondary sources.

Primary sources

Involved participants from all global stakeholders such as Solution providers, service providers, Industry associations, thought leaders etc. across levels such as CXOs, VPs and managers. Plus, our in-house industry experts having decades of industry experience contribute their consulting and advisory services.

Secondary sources

Include public sources such as regulatory frameworks, government IT spending, government demographic indicators, industry association statistics, and company publications along with paid sources such as Factiva, OneSource, Bloomberg among others.

outicon

Worldwide Electronic Smart Packaging Market – Technologies (RFID, NFC, BLE and EAS), Applications (Printed Sensor, Printed Touch, Printed Light, Printed RFID and Printed Antennas), End-Users (Food, Beverage, Healthcare, Personal Care, Logistics and Machineries), By Regions – Drivers, Opportunities, Trends, and Forecasts, 2016-2022
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